Electronic Packaging and Interconnection Handbook, 4/e
暫譯: 電子封裝與互連手冊，第4版

Description:

Electronic packaging is the underlying technology behind the creation of small electronic devices such as cell phones, PDAs, and laptops. Packaging advances in this field have driven the miniaturization of consumer electronics. This is THE standard reference in the field, nearly 75% rewritten to reflect the tremendous advances that have taken place in the past five years.

Table of Contents:

Part 1: Fundamental Technologies
Chapter 1: Materials for Electronic Packaging
Chapter 2: Thermal Management of Electronic Packages
Chapter 3: Shock, Vibration, and Operational Stress Management
Chapter 4: Connector and Interconnection Technologies
Chapter 5: Soldering and Cleaning Technologies
Part 2: Packaging and Interconnection Technologies
Chapter 6: Single Chips Packaging and Ball Grid Arrays
Chapter 7: Surface Mount Technology
Chapter 8: Hybrid and Multichip Module Packaging
Chapter 9: Chip Scale, Flip Chip, and Direct Chip Attachment
Chapter 10: Rigid and Flexible Printed Wiring Boards
Part 3: System Packaging Technologies
Chapter 11: Packaging High Speed and Microwave Systems
Chapter 12: Packaging High Voltage Systems
Chapter 13: Packaging of MEMs Systems
Chapter 14: Packaging of Optoelectronic Systems
Summary
Appendices