Semiconductor Microchips and Fabrication: A Practical Guide to Theory and Manufacturing (Hardcover)

Semiconductor Microchips and Fabrication

Advanced and highly illustrated guide to semiconductor manufacturing from an experienced industry insider

Semiconductor Microchips and Fabrication is a practical yet advanced book on the theory, design, and manufacturing of semiconductor microchips that describes the process using the principles of physics and chemistry, fills in the knowledge gaps for professionals and students who need to know how manufacturing equipment works, and provides valuable suggestions and solutions to many problems that students or engineers often encounter in semiconductor processing, including useful experiment results to help in process work.

The explanation of the semiconductor manufacturing process, and the equipment needed, is carried out based on the machines that are used in clean rooms over the world so readers understand how they can use the equipment to achieve their design and manufacturing ambitions. Combining theory with practice, all descriptions are carried out around the actual equipment and processes by way of a highly visual text, with illustrations including equipment pictures, manufacturing process schematics, and structures of semiconductor microchips.

Sample topics covered in Semiconductor Microchips and Fabrication include:

• An introduction to basic concepts, such as impedance mismatch from plasma machines and theories, such as energy bands and Clausius-Clapeyron equation
• Basic knowledge used in semiconductor devices and manufacturing machines, including DC and AC circuits, electric fields, magnetic fields, resonant cavity, and the components used in the devices and machines
• Transistor and integrated circuits, including bipolar transistors, junction field effect transistors, and metal-semiconductor field effect transistors
• The main processes used in the manufacturing of microchips, including lithography, metallization, reactive-ion etching (RIE), plasma-enhanced chemical vapor deposition (PECVD), thermal oxidation and implantation, and more
• The skills in the design and problem solving of processes, such as how to design a dry etching recipe, and how to solve the micro-grass problems in Bosch process

Through Semiconductor Microchips and Fabrication, readers can obtain the fundamental knowledge and skills of semiconductor manufacturing, which will help them better understand and use semiconductor technology to improve their product quality or project research. Before approaching this text, readers should have basic knowledge of physics, chemistry, and circuitry.

「半導體微晶片與製造」
「一位經驗豐富的業界內部人士所撰寫的先進且高度圖解的半導體製造指南」

「半導體微晶片與製造」是一本實用且先進的書籍，介紹了半導體微晶片的理論、設計和製造過程，並以物理和化學原理來描述這個過程。本書填補了專業人士和學生在了解製造設備運作方面的知識空白，並提供了許多解決問題的有價值建議和解決方案，這些問題學生或工程師在半導體製程中經常遇到，包括有用的實驗結果，有助於製程工作。

本書以全球各地的無塵室中使用的機器為基礎，解釋了半導體製造過程和所需設備，讓讀者了解如何使用設備來實現他們的設計和製造目標。結合理論與實踐，所有描述都圍繞著實際設備和製程進行，以高度視覺化的文字進行，包括設備圖片、製程示意圖和半導體微晶片結構的插圖。

「半導體微晶片與製造」中涵蓋的示例主題包括：

- 基本概念介紹，例如等離子機器的阻抗不匹配和能帶、Clausius-Clapeyron方程等理論
- 半導體器件和製造機器中使用的基本知識，包括直流和交流電路、電場、磁場、諧振腔以及器件和機器中使用的元件
- 電晶體和集成電路，包括雙極性電晶體、接面場效應電晶體和金屬-半導體場效應電晶體
- 微晶片製造中使用的主要製程，包括光刻、金屬化、反應離子蝕刻（RIE）、等離子增強化學氣相沉積（PECVD）、熱氧化和離子注入等
- 製程設計和問題解決的技巧，例如如何設計乾蝕刻配方，以及如何解決Bosch製程中的微草問題

通過「半導體微晶片與製造」，讀者可以獲得半導體製造的基礎知識和技能，這將幫助他們更好地理解和應用半導體技術，以提高產品質量或項目研究。在閱讀本書之前，讀者應具備物理、化學和電路的基礎知識。

Mr. Yaguang Lian is a Research Engineer at Holonyak Micro & Nanotechnology Lab, the University of Illinois, USA. In his twenty years of working, he has trained thousands of students in using the manufacturing machines. Before Mr. Lian came to the USA, he worked at the Hebei Semiconductor Research Institute (HSRI), China, for over 13 years. At HSRI, he oversaw the entire manufacturing process line, from implantation to packaging, in addition to IC design work. Working in the field of semiconductors for over 30 years, Mr. Lian deeply understands the key points of the manufacturing process and has a profound knowledge on both theory and equipment.

連亞光先生是美國伊利諾伊大學Holonyak微納米技術實驗室的研究工程師。在他二十年的工作經驗中，他培訓了數千名學生使用製造機器。在來到美國之前，連先生在中國河北半導體研究所（HSRI）工作了超過13年。在HSRI，他負責整個製造流程線，從植入到封裝，還包括IC設計工作。連先生在半導體領域工作超過30年，對製造過程的關鍵點有深刻的理解，並對理論和設備都有豐富的知識。