Demystifying Chipmaking

Description:

This book takes the reader through the actual manufacturing process of making a typical chip, from start to finish, including a detailed discussion of each step, in plain language. The evolution of today's technology is added to the story, as seen through the eyes of the engineers who solved some of the problems. The authors are well suited to that discussion since they are three of those same engineers. They have a broad exposure to the industry and its technology that extends all the way back to Shockley Laboratories, the first semiconductor manufacturer in Silicon Valley.

The CMOS (Complementary Metal-Oxide-Semiconductor) process flow is the focus of the discussion and is covered in ten chapters. The vast majority of chips made today are fabricated using this general method. In order to ensure that all readers are comfortable with the vocabulary, the first chapter carefully and clearly introduces the science concepts found in later chapters. A chapter is devoted to pointing out the differences in other manufacturing methods, such as the gallium arsenide technology that produces chips for cell phones. In addition, a chapter describing the nature of the semiconductor industry from a business perspective is included.

"The entire process of making a chip is surprisingly easy to understand. The part of the story that defies belief is the tiny dimensions: the conducting wires and other structures on a chip are more than a hundred times thinner than a hair - and getting thinner with every new chip design."

 

 

Table of Contents:

Science Overview; Support Technologies: Chip Design, Photomasks, Cleanrooms, Making Silicon Wafers; Forming Wells; Isolate Active Areas:
Shallow Trench Isolation, Plasma Etching, Chemical Mechanical Polishing, Chemical Vapor Deposition; Form Transistor Gates:High-k Dielectric Materials, Extreme Ultra-Violet Photolithography; Dope Sources and Drains; Cover Transistors with Glass and Etch Contact Holes; Tungsten Contact Plugs: Chemical Vapor Deposition of Tungsten, Chemical Mechanical Polishing of metals; First Level Metal Interconnections: Metal Sputter (Physical Vapor Deposition), Plasma Etch of Aluminum; Second Level Metal; Final Passivation; Testing the Finished Chips:Chip packaging; How Some Processes Differ from CMOS: Bipolar Technology and Gallium Arsenide Technology; The Nature of the Business: An Overview of the Business Aspects of the Semiconductor Industry

描述：
本書以平實的語言，從頭到尾詳細討論了製造典型晶片的實際製程，包括每個步驟。同時，透過解決問題的工程師的視角，還介紹了當今技術的演進。由於作者本身就是其中三位工程師，他們對該行業及其技術有廣泛的了解，甚至可以追溯到矽谷的第一家半導體製造商Shockley Laboratories。

本書重點討論了CMOS（互補金屬氧化物半導體）製程流程，共有十章。如今，絕大多數晶片都是使用這種通用方法製造的。為了確保所有讀者對術語感到舒適，第一章詳細且清晰地介紹了後續章節中的科學概念。其中一章專門指出了其他製造方法的差異，例如為手機生產晶片的砷化鎵技術。此外，還包括一章從商業角度描述半導體行業的性質。

“製造晶片的整個過程令人驚訝地容易理解。令人難以置信的是微小的尺寸：晶片上的導線和其他結構比一根頭髮細超過一百倍，而且隨著每一個新的晶片設計，它們還在變得更薄。”

目錄：
科學概述；支援技術：晶片設計、光罩、無塵室、矽晶圓製造；形成井；隔離活動區域：淺沟隔离、等离子体刻蚀、化学机械抛光、化学气相沉积；形成晶体管栅：高介电常数介电材料、极紫外光刻；掺杂源和漏极；用玻璃覆盖晶体管并刻蚀接触孔；钨接触塞：化学气相沉积钨、金属化学机械抛光；第一层金属互连：金属溅射（物理气相沉积）、铝等离子体刻蚀；第二层金属；最终封装；测试成品晶片：晶片封装；一些与CMOS不同的工艺：双极技术和砷化镓技术；行業的性质：半导体行业的商业概述