3D IC Stacking Technology (Hardcover)

Banqiu Wu, Ajay Kumar , Sesh Ramaswami

  • 出版商: McGraw-Hill Education
  • 出版日期: 2011-07-28
  • 售價: $2,500
  • 貴賓價: 9.8$2,450
  • 語言: 英文
  • 頁數: 544
  • 裝訂: Hardcover
  • ISBN: 007174195X
  • ISBN-13: 9780071741958
  • 立即出貨 (庫存=1)




The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

  • High density through silicon stacking (TSS) technology
  • Practical design ecosystem for heterogeneous 3D IC products
  • Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
  • Process integration for TSV manufacturing
  • High-aspect-ratio silicon etch for TSV
  • Dielectric deposition for TSV
  • Barrier and seed deposition
  • Copper electrodeposition for TSV
  • Chemical mechanical polishing for TSV applications
  • Temporary and permanent bonding
  • Assembly and test aspects of TSV technology