Microchip Fabrication: A Practical Guide to Semiconductor Processing, 6/e (Hardcover)

Peter Van Zant

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商品描述

The most complete, current guide to semiconductor processing

Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.

State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.

COVERAGE INCLUDES:

  • The semiconductor industry
  • Properties of semiconductor materials and chemicals
  • Crystal growth and silicon wafer preparation
  • Wafer fabrication and packaging
  • Contamination control
  • Productivity and process yields
  • Oxidation
  • The ten-step patterning process--surface preparation to exposure; developing to final inspection
  • Next generation lithography
  • Doping
  • Layer deposition
  • Metallization
  • Process and device evaluation
  • The business of wafer fabrication
  • Devices and integrated circuit formation
  • Integrated circuits
  • Packaging

 

商品描述(中文翻譯)

最完整、最新的半導體製程指南

經過全面修訂以涵蓋該領域的最新進展,《Microchip Fabrication》第六版解釋了半導體製程的每個階段,從原材料準備到測試,再到包裝和運送成品設備。這本實用資源提供易於理解的資訊,介紹了現代半導體製造材料和工藝背後的物理、化學和電子基礎知識。

本新版討論了圖案化、摻雜和層積步驟中使用的最先進工藝和尖端技術。充滿詳細的插圖和實際案例,這是一本全面且最新的高科技產業技術基礎介紹。

涵蓋範圍包括:


  • 半導體產業

  • 半導體材料和化學物質的特性

  • 晶體生長和矽晶片製備

  • 晶圓製造和封裝

  • 污染控制

  • 生產力和製程產量

  • 氧化

  • 十步圖案化製程 - 從表面處理到曝光;從開發到最終檢查

  • 下一代光刻技術

  • 摻雜

  • 層積

  • 金屬化

  • 製程和器件評估

  • 晶圓製造業務

  • 器件和集成電路形成

  • 集成電路

  • 封裝