Practical Guide for the Reliable Packaging of Electronics: Thermal and Mechanical Design and Analysis
暫譯: 電子可靠包裝實務指南：熱與機械設計與分析

Jamnia, Ali

Practical Guide for the Reliable Packaging of Electronics: Thermal and Mechanical Design and Analysis
  • 出版商: CRC
  • 出版日期: 2025-09-25
  • 售價: $6,160
  • 貴賓價: 9.5 折 $5,852
  • 語言: 英文
  • 頁數: 14
  • 裝訂: Hardcover - also called cloth, retail trade, or trade
  • ISBN: 1032881143
  • ISBN-13: 9781032881140
  • 相關分類: 電機學 Electric-machinery

    • 海外代購書籍(需單獨結帳)

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商品描述

A definitive guide for both newcomers to the field and those in need of a refresher, the fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insights into potential failures. This edition equips design engineers with the tools to assess their work in the early stages of development, helping them identify and address weak points before they lead to system failures.

As the demand for integrating more electronic capabilities into smaller packages continues to rise, product developers and manufacturers must carefully consider how module placement and component selection impact performance. This updated edition features expanded content, including advancements in cooling technologies and materials, guidance on vibration isolation and design challenges, deeper insights into system and subsystem reliability, robust test method development, and a newly added section on applying Six Sigma DMAIC methodology for thermal and mechanical failure analysis.

By consulting this essential resource, engineers, program managers, and quality assurance professionals involved in electromechanical systems will gain a solid foundation in electronics packaging. Readers will learn to establish design guidelines, recognize potential reliability issues, and perform more thorough analyses, ultimately leading to more reliable and efficient system designs.

商品描述(中文翻譯)

一本針對新手及需要複習的專業人士的權威指南，《電子可靠包裝實用指南》第四版提供了對電機系統設計的熱學和機械方面的全面理解，並深入探討潛在的故障。這一版為設計工程師提供了在開發早期評估其工作的工具，幫助他們識別和解決弱點，以防止系統故障的發生。

隨著對將更多電子功能整合到更小包裝中的需求不斷上升，產品開發者和製造商必須仔細考慮模組放置和元件選擇如何影響性能。本次更新的版本包含擴展內容，包括冷卻技術和材料的進展、振動隔離和設計挑戰的指導、系統和子系統可靠性的深入見解、穩健的測試方法開發，以及新增的關於應用六西格瑪DMAIC方法論進行熱學和機械故障分析的部分。

通過參考這一重要資源，參與電機系統的工程師、項目經理和質量保證專業人士將獲得電子包裝的堅實基礎。讀者將學會建立設計指導方針、識別潛在的可靠性問題，並進行更徹底的分析，最終導致更可靠和高效的系統設計。

作者簡介

Dr. Jamnia has published four books with CRC Press, a large number of engineering papers and presentations as well as non-technical articles along with a number of patents. He has a demonstrated basic understanding of the engineering principles particularly in the areas of fluid flow, heat transfer and stress analysis. His primary expertise lies in electromechanical systems design and analysis particularly using numerical approximations and computer simulation. Currently, he heads design for reliability, compliance and safety activities for a medical device company.

His focus on the issues of electronics packaging began in the early 90s. And since 1995, he has been involved with the design and development of innovative electronics system particularly in the medical field. His prime achievement was the development of a specialized computer systems called the Learning Stationä to be used as teaching tool for individuals with cognitive delays and/or physical disabilities.

Dr. Jamnia enjoys teaching and interacting with others. In fact, Society for Automotive Engineers (SAE) had sponsored him for nearly ten years to teach workshops on electronics packaging form a thermal and mechanical design and analysis point of view.

作者簡介(中文翻譯)

Dr. Jamnia 已經與 CRC Press 出版了四本書籍，並發表了大量的工程論文和報告，以及一些非技術性文章和多項專利。他對工程原則有基本的理解，特別是在流體流動、熱傳遞和應力分析等領域。他的主要專長在於機電系統的設計和分析，特別是使用數值近似和電腦模擬。目前，他負責一家醫療器材公司的可靠性、合規性和安全性設計工作。

他對電子封裝問題的關注始於90年代初。自1995年以來，他參與了創新電子系統的設計和開發，特別是在醫療領域。他的主要成就之一是開發了一種專門的計算機系統，稱為 Learning Stationä，作為對於有認知延遲和/或身體殘疾的個體的教學工具。

Dr. Jamnia 喜歡教學並與他人互動。事實上，汽車工程師學會（SAE）曾經贊助他近十年，教授從熱設計和機械設計分析的角度出發的電子封裝工作坊。

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