Fundamentals of Device and Systems Packaging:Technologies and Applications, 2/e (Hardcover)

Tummala, Rao

  • 出版商: McGraw-Hill Education
  • 出版日期: 2019-09-02
  • 定價: $5,500
  • 售價: 9.5$5,225
  • 語言: 英文
  • 頁數: 848
  • 裝訂: Hardcover - also called cloth, retail trade, or trade
  • ISBN: 1259861554
  • ISBN-13: 9781259861550
  • 相關分類: 電機學 Electric-machinery
  • 立即出貨 (庫存 < 3)

買這商品的人也買了...

商品描述

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

 

A fully updated, comprehensive guide to microelectronic device and systems packaging principles and practices

This thoroughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. You will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection, and radiation heat transfer; thermo-mechanical failures and reliability;advanced packaging materials at micro and nanoscales; ceramic, organic, glass, and silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with actives; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronics; mems and sensor packaging;encapsulation, molding and sealing; and printed wiring board and its assembly to form end-product systems.

Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition introduces the concept of Moore's Law for packaging, as Moore's Law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore's Law for Packaging (MLP) can be viewed as interconnecting and integrating many smaller chips with high aggregate transistor density, at higher performance and lower cost than Moore's Law for ICs. This book lays the groundwork for Moore's Law for Packaging by showing how I/Os have evolved from one package family node to the next, starting with

 

 

 

 

 

商品描述(中文翻譯)

出版商註解:從第三方賣家購買的產品,出版商不保證其品質、真實性或包含的任何線上權益。

全面更新的微電子器件和系統封裝原則和實踐的全面指南。

這本經過全面修訂的書提供了最新的器件和系統封裝技術和應用的基礎知識。您將深入了解構成任何電子系統的15種核心封裝技術,包括用於電力、信號和電磁干擾的電氣設計;傳導、對流和輻射熱傳的熱設計;熱機械故障和可靠性;微納米尺度的先進封裝材料;陶瓷、有機、玻璃和矽基板。此資源還討論了被動元件,如電容器、電感器和電阻器及其與主動元件的接近集成;晶片到封裝的互連和組裝;晶圓和面板嵌入技術;具有和不具有TS的3D封裝;射頻和毫米波封裝;光電子學的作用;mems和感測器封裝;封裝、模塑和密封;以及印刷布線板及其組裝形成最終產品系統。

《器件和系統封裝基礎:技術和應用》第二版介紹了封裝的摩爾定律概念,因為由於物理、材料、電氣和財務限制,IC的摩爾定律即將結束。封裝的摩爾定律可以被視為將許多更小的晶片以高集成晶體管密度連接和整合在一起,性能更高、成本更低,優於IC的摩爾定律。本書通過展示I/O如何從一個封裝家族節點演變到下一個,為封裝的摩爾定律奠定了基礎。

作者簡介

Dr. Rao Tummala is a chair professor and director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of all three volumes of Microelectronics Packaging Handbook, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. Dr. Tummala was a longtime packaging technologist and IBM Fellow at IBM.

作者簡介(中文翻譯)

Dr. Rao Tummala是喬治亞理工學院微系統封裝中心的主席教授和主任。他是《微電子封裝手冊》三卷的作者,這本暢銷的參考書籍定義了整個領域,他是一位電子和材料工程師,也是一位有豐富經驗的微電子設計師。Tummala博士曾是IBM的封裝技術專家和IBM Fellow。