Electronic Materials and Processes Handbook, 3/e
暫譯: 電子材料與工藝手冊,第3版

Charles Harper

  • 出版商: McGraw-Hill Education
  • 出版日期: 2003-08-07
  • 售價: $4,490
  • 貴賓價: 9.5$4,266
  • 語言: 英文
  • 頁數: 800
  • 裝訂: Hardcover
  • ISBN: 0071402144
  • ISBN-13: 9780071402149
  • 海外代購書籍(需單獨結帳)

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商品描述

Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct today’s cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications.

This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design.

 :           

   Chapter 1: Development and Fabrication of IC Chips
   Chapter 2: Plastics, Elastomers, and Composites
   Chapter 3: Ceramics and Glasses
   Chapter 4: Metals
   Chapter 5: Solder Technologies for Electronic Packaging and Assembly
   Chapter 6: Electroplating and Deposited Metallic Coatings
   Chapter 7: Printed Circuit Board Fabrication
   Chapter 8: Materials and Processes for Hybrid Microelectronics and Multichip Modules
   Chapter 9: Adhestives Underfills, and Coatings in Electronics Assemblies
   Chapter 10: Thermal Management Materials and Systems
    Index

商品描述(中文翻譯)

電子材料是構成晶片和封裝的實際半導體、塑料、金屬和陶瓷,這些材料使我們能夠製造當今的手機、掌中寶和個人數位助理(PDA)。從個人電腦(PC)到更小型的通訊設備的應用轉變,推動了電子產品的微型化趨勢,這反過來又帶來了在創造符合其規格的材料方面的新挑戰。

這一新版是自1993年以來的首次更新,內容完全重寫,反映了工程材料在熱管理、靈活性和微型尺寸方面的重要性。這本新手冊將成為任何從事電子封裝、製造或組裝設計的人的寶貴工具。

目錄:
   第1章:集成電路晶片的開發與製造
   第2章:塑料、彈性體和複合材料
   第3章:陶瓷和玻璃
   第4章:金屬
   第5章:電子封裝和組裝的焊接技術
   第6章:電鍍和沉積金屬塗層
   第7章:印刷電路板製造
   第8章:混合微電子學和多晶片模組的材料與工藝
   第9章:電子組裝中的粘合劑、填充物和塗層
   第10章:熱管理材料和系統
    索引