The Semiconductor Manufacturing Handbook: Fabrication Processes, Equipment, Materials, Packaging, Testing, and Advanced Chip Technologies
暫譯: 半導體製造手冊:製程、設備、材料、封裝、測試及先進晶片技術

Barua, Prasun

  • 出版商: Independently Published
  • 出版日期: 2026-06-18
  • 售價: $1,240
  • 貴賓價: 9.5$1,178
  • 語言: 英文
  • 頁數: 260
  • 裝訂: Quality Paper - also called trade paper
  • ISBN: 9798182112062
  • ISBN-13: 9798182112062
  • 相關分類: 半導體
  • 海外代購書籍(需單獨結帳)

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商品描述

The semiconductor industry forms the technological foundation of modern civilization. From artificial intelligence computing platforms and advanced data centers to automotive electronics, renewable energy systems, communication networks, and intelligent consumer devices, semiconductor technology continues to drive the progress of the digital era. At the center of this transformation is the integrated circuit, where billions of transistors are manufactured with extraordinary precision at the atomic and molecular scale.
Although semiconductor devices power nearly every aspect of modern life, the complex manufacturing processes behind them remain largely invisible outside advanced fabrication facilities. Within these highly controlled environments, engineers combine materials science, physics, chemistry, mechanical engineering, and advanced automation systems to transform silicon wafers into sophisticated electronic devices.
The Semiconductor Manufacturing Handbook provides a comprehensive exploration of the technologies, manufacturing processes, equipment, materials, and engineering principles behind modern semiconductor fabrication. This book bridges the gap between semiconductor theory and the practical challenges encountered in high-volume industrial chip production.
Rather than focusing only on technology marketing terms such as "nanometer nodes," this handbook examines the engineering foundations that make advanced semiconductor devices possible, including wafer preparation, lithography, deposition, etching, ion implantation, process integration, defect control, metrology, advanced packaging, and semiconductor testing.
Designed for semiconductor engineers, electrical and electronics engineers, researchers, engineering students, and technology professionals, this book provides a structured understanding of how modern integrated circuits are manufactured and how emerging semiconductor technologies are shaping the future of computing, energy, transportation, and electronics.
By combining fundamental concepts with industrial manufacturing practices, this handbook serves as a practical reference for understanding the complete semiconductor manufacturing journey-from raw silicon materials and wafer fabrication to advanced chip architectures and next-generation semiconductor technologies.

商品描述(中文翻譯)

半導體產業構成了現代文明的技術基礎。從人工智慧計算平台和先進數據中心到汽車電子、可再生能源系統、通信網絡和智能消費設備,半導體技術持續推動數位時代的進步。在這一轉型的中心是集成電路,數十億個晶體管以原子和分子尺度的非凡精度製造而成。

儘管半導體設備為現代生活的幾乎每個方面提供動力,但其背後複雜的製造過程在先進的製造設施之外仍然大多不為人知。在這些高度控制的環境中,工程師結合材料科學、物理學、化學、機械工程和先進自動化系統,將矽晶圓轉變為複雜的電子設備。

《半導體製造手冊》提供了對現代半導體製造背後的技術、製造過程、設備、材料和工程原則的全面探索。本書彌合了半導體理論與在高產量工業晶片生產中遇到的實際挑戰之間的鴻溝。

本手冊不僅專注於「奈米節點」等技術行銷術語,而是檢視使先進半導體設備成為可能的工程基礎,包括晶圓準備、光刻、沉積、蝕刻、離子植入、工藝整合、缺陷控制、計量、先進封裝和半導體測試。

本書旨在為半導體工程師、電氣與電子工程師、研究人員、工程學生和技術專業人士提供結構化的理解,說明現代集成電路是如何製造的,以及新興的半導體技術如何塑造計算、能源、交通和電子產品的未來。

通過將基本概念與工業製造實踐相結合,本手冊作為理解完整半導體製造過程的實用參考,涵蓋從原材料矽和晶圓製造到先進晶片架構和下一代半導體技術的各個階段。