Semiconductor Device Fabrication Process
暫譯: 半導體元件製造流程

Welcome to Semiconductor Device Fabrication Process! This is a nonfiction science book which contains various topics on semiconductor device fabrication process. The process of fabricating semiconductor devices, which are primarily integrated circuit (IC) chips like modern computer processors, microcontrollers, and memory chips like NAND flash and DRAM found in common electrical and electronic equipment, is known as semiconductor device manufacturing. Electronic circuits are gradually built on a wafer consisting of pure semiconducting material using a multi-step sequence of photolithographic and chemical processing techniques such as surface passivation, thermal oxidation, planar diffusion, and junction isolation. Although different compound semiconductors are utilized for specialized applications, silicon is virtually always employed. From commencement to packaged chips ready for distribution, the process requires at least six to eight weeks excluding the circuit design, and it is carried out in highly specialized semiconductor fabrication plants, also known as foundries or fabs. The main area of a fab, the clean room, is where all fabrication takes place. Each semiconductor component product takes hundreds of processes to be produced. After sorting, the process is divided into eight steps such as wafer processing, oxidation, photography, etching, film deposition, interconnection, testing, and packaging. Thanks for reading the book.