The Semiconductor Manufacturing Handbook: Fabrication Processes, Equipment, Materials, Packaging, Testing, and Advanced Chip Technologies
暫譯: 《半導體製造手冊:製程、設備、材料、封裝、測試與先進晶片技術》

Barua, Prasun

  • 出版商: Independently Published
  • 出版日期: 2026-06-18
  • 售價: $1,800
  • 貴賓價: 9.5 折 $1,710
  • 語言: 英文
  • 頁數: 260
  • 裝訂: Quality Paper - also called trade paper
  • ISBN: 9798182112062
  • ISBN-13: 9798182112062
  • 相關分類: 半導體
  • 立即出貨 (庫存=1)

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商品描述

The semiconductor industry forms the technological foundation of modern civilization. From artificial intelligence computing platforms and advanced data centers to automotive electronics, renewable energy systems, communication networks, and intelligent consumer devices, semiconductor technology continues to drive the progress of the digital era. At the center of this transformation is the integrated circuit, where billions of transistors are manufactured with extraordinary precision at the atomic and molecular scale.
Although semiconductor devices power nearly every aspect of modern life, the complex manufacturing processes behind them remain largely invisible outside advanced fabrication facilities. Within these highly controlled environments, engineers combine materials science, physics, chemistry, mechanical engineering, and advanced automation systems to transform silicon wafers into sophisticated electronic devices.
The Semiconductor Manufacturing Handbook provides a comprehensive exploration of the technologies, manufacturing processes, equipment, materials, and engineering principles behind modern semiconductor fabrication. This book bridges the gap between semiconductor theory and the practical challenges encountered in high-volume industrial chip production.
Rather than focusing only on technology marketing terms such as "nanometer nodes," this handbook examines the engineering foundations that make advanced semiconductor devices possible, including wafer preparation, lithography, deposition, etching, ion implantation, process integration, defect control, metrology, advanced packaging, and semiconductor testing.
Designed for semiconductor engineers, electrical and electronics engineers, researchers, engineering students, and technology professionals, this book provides a structured understanding of how modern integrated circuits are manufactured and how emerging semiconductor technologies are shaping the future of computing, energy, transportation, and electronics.
By combining fundamental concepts with industrial manufacturing practices, this handbook serves as a practical reference for understanding the complete semiconductor manufacturing journey-from raw silicon materials and wafer fabrication to advanced chip architectures and next-generation semiconductor technologies.

商品描述(中文翻譯)

半導體產業構成現代文明的技術基礎。從人工智慧運算平台與先進資料中心,到汽車電子、再生能源系統、通訊網路及智慧型消費裝置,半導體技術持續推動數位時代的進步。這場轉型的核心是積體電路(integrated circuit),其中數十億個電晶體以非凡的精準度,在原子與分子尺度上完成製造。

雖然半導體裝置幾乎驅動現代生活的各個面向,但其背後複雜的製造流程,在先進晶圓製造廠之外仍大多不為人所見。在這些高度受控的環境中,工程師結合材料科學、物理學、化學、機械工程,以及先進自動化系統,將矽晶圓轉化為精密複雜的電子裝置。

《半導體製造手冊》全面探討現代半導體製造背後的技術、製造流程、設備、材料與工程原理。本書銜接半導體理論與高產量工業晶片生產中所面臨的實務挑戰。

本手冊不僅聚焦於「奈米製程節點(nanometer nodes)」等技術行銷術語,更深入檢視實現先進半導體裝置所需的工程基礎,包括晶圓準備、微影、沉積、蝕刻、離子佈植、製程整合、缺陷控制、量測、先進封裝,以及半導體測試。

本書專為半導體工程師、電機與電子工程師、研究人員、工程相關科系學生及科技專業人士設計,協助讀者有系統地理解現代積體電路的製造方式,以及新興半導體技術如何形塑運算、能源、運輸與電子產業的未來。

本手冊結合基礎概念與工業製造實務,提供理解完整半導體製造歷程的實用參考,涵蓋從原始矽材料與晶圓製造,到先進晶片架構及新世代半導體技術的各個階段。